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No. of Contacts | 2 - 90 |
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Termination Technology | Press-fit |
Board-to-Board Distance | 20 mm |
Operating Temperature Range | -55°C to +125°C |
Insulator Material | PBT |
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Contact Material | Copper alloy |
Plating | Sn |
Pitch | 2.54 mm or individually assembled |
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Operational Current | max. 11 A at 20°C per pin (1x10 pins, height 15 mm) max. 7 A at 20°C per pin (2x10 pins, height 15 mm) max. 6 A at 20°C per pin (3x10 pins, height 15 mm) |
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Contact Resistance | <5 mΩ |
Clearance and Creepage | min. 0.44 mm / 0.57 mm (within the row) min. 1.94 / 2.07 mm (between the rows) |
Assembly | manual / semi-automatic / fully automatic |
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UL file | E130314 |
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Environment | RoHS compliant |
For details please download the drawings or contact ept directly.
Material | imm. Sn printed circuit boards |
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Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.4 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | imm. Sn plating, max. 1.5 µm |
F Annular Ring | min. 0.1 mm |
Material | Ni, Au printed circuit boards |
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Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.4 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.1 mm |
Material | pure Cu printed circuit boards |
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Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.4 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | OSP*, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Available on request
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