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Varpol Pin Headers & Sockets

High Quality, Adaptable, and Robust
VarPol pin headers and sockets from ept offer a plethora of possibilities for connecting circuit boards. One or two rows, variable pin counts, different termination lengths, straight or angled – the choice is yours! The product also allows for seamlessly connecting sockets.In addition, Tcom press®, our tried and proven press-fit zone, allows you to eliminate the soldering process and greatly increase connection reliability.

a large selection of contact lengths and termination lengths
a choice of performance levels: 50 and 250 mating cycles
sockets can be joined end-to-end
simple and inexpensive processing
Tcom press® press-fit zone

More information on Varpol

VarPol Female connector 2-row Part No. 962-60nn2-03

FREE samples

Description Technical Specifications Dimensions Hole Specifications

Illustration similar

VarPol FL Anschlusslaenge 3 4 Zeichnung.png

Performance Level 3
Press-fit
termination length 3.4 mm
2 - 108 contacts (nn in part number = pins / row)
2-row

Further Information

Product Data Sheet

Delivery time

go to stock check

Basics

Performance Level	3
No. of Contacts	2 - 108
Termination Technology	Press-fit
Termination Length	3.4 mm
Board-to-Board Distance	11.45 mm - 23.35 mm
Operating Temperature Range	-55°C to +125°C

Material

Insulator Material	PBT glass filled, UL 94 V-0
Contact Material	Copper alloy

Mechanical

Pitch	2.54 mm
Mating Force per Pin	max. 0.9 N
Separating Force per Pin	min 0.6 N

Electrical

Operational Current	max. 1.9 A
Operational Voltage	150 V
Contact Resistance	< 20 mΩ
Clearance and Creepage	1.2 mm
Insulation Resistance	>10⁶ MΩ

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

VarPol FL Zeichnung Abmessungen1.png

For details please download the drawings or contact ept directly.

Material	imm. Sn printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	imm. Sn plating, max. 1.5 µm
F Annular Ring	min. 0.1 mm

Material	Ni, Au printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni
F Annular Ring	min. 0.1 mm

Material	pure Cu printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	OSP*, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm
F Annular Ring	min. 0.1 mm

Material	HAL Sn printed circuit boards
Nominal Hole	Ø 1.0 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 1.0 +0.09 / -0.06 mm
C Drill Hole	1.15 ±0.025 mm
D Cu Plating	min. 25 µm
E Surface	HAL Sn, 5 - 15 µm
F Annular Ring	min. 0.1 mm