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Varpol Pin Headers & Sockets
High Quality, Adaptable, and Robust
VarPol pin headers and sockets from ept offer a plethora of possibilities for connecting circuit boards. One or two rows, variable pin counts, different termination lengths, straight or angled – the choice is yours! The product also allows for seamlessly connecting sockets.In addition, Tcom press®, our tried and proven press-fit zone, allows you to eliminate the soldering process and greatly increase connection reliability.
- a large selection of contact lengths and termination lengths
- a choice of performance levels: 50 and 250 mating cycles
- sockets can be joined end-to-end
- simple and inexpensive processing
- Tcom press® press-fit zone
VarPol Female connector 2-row Part No. 962-60nn2-03
FREE samples
Illustration similar
- Performance Level 3
- Press-fit
- termination length 3.4 mm
- 2 - 108 contacts (nn in part number = pins / row)
- 2-row
Further Information
Delivery time
Basics
| Performance Level | 3 |
|---|---|
| No. of Contacts | 2 - 108 |
| Termination Technology | Press-fit |
| Termination Length | 3.4 mm |
| Board-to-Board Distance | 11.45 mm - 23.35 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | PBT glass filled, UL 94 V-0 |
|---|---|
| Contact Material | Copper alloy |
Mechanical
| Pitch | 2.54 mm |
|---|---|
| Mating Force per Pin | max. 0.9 N |
| Separating Force per Pin | min 0.6 N |
Electrical
| Operational Current | max. 1.9 A |
|---|---|
| Operational Voltage | 150 V |
| Contact Resistance | < 20 mΩ |
| Clearance and Creepage | 1.2 mm |
| Insulation Resistance | >106 MΩ |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
For details please download the drawings or contact ept directly.
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
| Material | pure Cu printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | OSP*, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
| F Annular Ring | min. 0.1 mm |
| Material | HAL Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | HAL Sn, 5 - 15 µm |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Further Information
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Contact ept GmbH
Head office+49 (0) 8861 / 2501 0+49 (0) 8861 / 5507sales@ept.deBergwerkstr. 50
86971 Peiting, Germany
86971 Peiting, Germany
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