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For ATCA® applications, ept offers both signal connectors and power connectors that meet PICMG® specifications. Ept connectors meet the highest quality standards and help make AdvancedTCA® systems much more reliable.
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Specification | PICMG®AMC.0 R2.0 |
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No. of Contacts | 170 |
Termination Technology | Press-fit |
Termination Length | 2.0 mm |
Operating Temperature Range | -55°C to +105°C |
Insulator Material | LCP, UL 94 V-0 |
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Contact Material | Copper alloy |
Plating | PdNi + Au flash over Ni |
Pitch | 0.75 mm |
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Mating Force | max. 100 N |
Separating Force | max. 65 N |
Durability | 200 mating cycles |
Operational Current | 1.52 A @ 70°C max. 30°C temperature rise |
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Clearance and Creepage | min. 0.1 mm |
Insulation Resistance | 108 Ω |
Test Voltage | 80 V r.m.s |
Data Transfer Rate | 12.5 Gbit/s |
Impedance | 100 Ω± 10% |
UL file | E130314 |
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Environment | RoHS compliant |
For details please download the drawings or contact ept directly.
Material | chem. Sn printed circuit boards |
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Nominal Hole | Ø 0.55 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.55 ±0.05 mm |
C Drill Hole | 0.64 ±0.01 mm |
D Cu Plating | min. 25 µm |
E Surface | imm. Sn plating, max. 1.5 µm |
F Annular Ring | min. 0.15 mm |
Material | Ni, Au printed circuit boards |
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Nominal Hole | Ø 0.55 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 0.55 ±0.05 mm |
C Drill Hole | 0.64 ±0.01 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.15 mm |
Plated through-hole according to IEC 60352-5
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