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Specification | PICMG® COM.0 Rev 3.0 |
---|---|
No. of Contacts | 120 |
Termination Technology | SMT |
Board-to-Board Distance | 8 mm |
Operating Temperature Range | -40°C to +125°C |
Insulator Material | LCP, UL 94 V-0 |
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CTI value IEC 60112 | 125 |
Contact Material | Copper alloy |
Plating | Au over Ni |
Pitch | 0.5 mm |
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Mating Force per Pin | max. 0.9 N |
Separating Force per Pin | min. 0.1 N |
Durability | 30 mating cycles |
Coplanarity | max. 0.1 mm |
Operational Current | max. 0.5 A |
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Operational Voltage | 50 VAC |
Contact Resistance | max. 75 mΩ |
Clearance and Creepage | ≥ 0.15 mm |
Insulation Resistance | > 100 MΩ |
Test Voltage | 200 VAC |
Data Transfer Rate | 16 Gbit/s |
Soldering Temperature | 260°C per J-STD-020 |
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MSL | 1 |
Assembly | Pick and Place |
UL file | E130314 |
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Environment | RoHS compliant |
For details please download the drawings or contact ept directly.
Plated through-hole according to IEC 60352-5
for the connector with pick & place cap use part number 401-55413-51
Available on request
Tape and Reel
600 pcs / Reel
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