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hm 2.0 – Hardmetric Connectors

High Contact Density
The hm 2.0 series of hardmetric connectors was developed in accordance with the international IEC 61076-4-101 standard. These shielded connectors have a pitch of 2 mm and are suitable for applications that require high contact density and reliability. Standardization ensures that the connectors are compatible with products from different manufacturers.

wide selection of types
modular connectors with a pitch of 2 mm
5 or 8 signal rows
12 different pin lengths
customized assembly layout as an option
available with or without shielding
supports a data transfer rate of up to 3.125 Gbps
robust design
accessories such as shrouds and coding keys

More information on hm 2.0

hm2.0 lower shield, type F Part No. 246-31600-1

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Description Technical Specifications Dimensions Hole Specifications

Illustration similar

11 contacts
termination length 3.4 mm
for PCB ≥ 1.44 mm
tested according to IEC 61076-4-101

Further Information

Product Data Sheet

Delivery time

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Basics

Specification	IEC 61076-4-101
Performance Level	2
No. of Contacts	11
Termination Technology	Press-fit
Termination Length	3.4 mm
Operating Temperature Range	-55°C to +125°C

Material

Contact Material	Bronze

Mechanical

Pitch	2.0 mm
Mating Force per Pin	Shielding: max. 1 N
Separating Force per Pin	Shielding: min. 0.15 N
Durability	> 250 mating cycles

Electrical

Operational Current	1.5 A @ +20°C, 1.0 A @ +70°C
Contact Resistance	max. 20 mΩ
Insulation Resistance	min. 10⁴ MΩ
Test Voltage	750 V r.m.s
Data Transfer Rate	3.125 Gbit/s

Approval / Compliance

Environment	RoHS compliant

hm F FL Zeichnung Abmessungen1.png hm F FL Zeichnung Abmessungen2.png hm F FL Zeichnung Abmessungen3.png hm F FL Lochbild.png

For details please download the drawings or contact ept directly.

Material	imm. Sn printed circuit boards
Nominal Hole	Ø 0.6 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 0.60 ±0.05 mm
C Drill Hole	0.70 ±0.02 mm
D Cu Plating	min. 25 µm
E Surface	max. 1.5 µm; imm. Sn plating
F Annular Ring	min. 0.1 mm

Material	Ni, Au printed circuit boards
Nominal Hole	Ø 0.6 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 0.60 ±0.05 mm
C Drill Hole	0.70 ±0.02 mm
D Cu Plating	min. 25 µm
E Surface	Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni
F Annular Ring	min. 0.1 mm

Material	pure Cu printed circuit boards
Nominal Hole	Ø 0.6 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 0.60 ±0.05 mm
C Drill Hole	0.70 ±0.02 mm
D Cu Plating	min. 25 µm
E Surface	OSP*,z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm
F Annular Ring	min. 0.1 mm

Material	HAL Sn printed circuit boards
Nominal Hole	Ø 0.6 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 0.60 ±0.05 mm
C Drill Hole	0.70 ±0.02 mm
D Cu Plating	min. 25 µm
E Surface	HAL Sn, 5 - 15 µm
F Annular Ring	min. 0.1 mm